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MEMS and Microsystems (View More...)
| Micromachining Process | lec11 | 5:34 to 12:04 | VIDEO | |
| Wafer Bonding and Packaging of MEMS | lec30 | 21:23 to 23:29 | VIDEO | |
| Wafer Bonding and Packaging of MEMS | lec30 | 23:29 to 27:55 | VIDEO |
VLSI Technology (View More...)
| Oxidation I Kinetics of Oxidation | lec11 | 11:09 to 15:07 | VIDEO | |
| Oxidation I Kinetics of Oxidation | lec11 | 15:43 to 17:29 | VIDEO | |
| Oxidation I Kinetics of Oxidation | lec11 | 18:11 to 19:48 | VIDEO |
High Speed Devices and Circuits (View More...)
| GaAs and InP devices for Microelectronics | lec11 | 05:44 to 13:44 | VIDEO | |
| GaAs and InP devices for Microelectronics | lec11 | 13:44 to 16:19 | VIDEO | |
| Hetero Junctions | lec30 | 53:00 to upto | VIDEO |